Friday, January 9, 2009

ISI Web of Knowledge Alert - Thompson, P

ISI Web of Knowledge Citation Alert (Solaris 2.1)
Cited Article:   Thompson, P. A general boundary condition for liquid flow at solid surfaces
Alert Expires:   21 OCT 2009
Number of Citing Articles:   1 new records this week (1 in this e-mail)
Organization ID:   3b97d1bbc1878baed0ab183d8b03130b

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Title: REVIEW OF THE EFFECTS OF SURFACE TOPOGRAPHY, SURFACE CHEMISTRY, AND FLUID PHYSICS ON EVAPORATION AT THE CONTACT LINE
Authors: Plawsky, J; Ojha, M; Chatterjee, A; Wayner, P
Author Full Names: Plawsky, Joel L.; Ojha, Manas; Chatterjee, Arya; Wayner, Peter C., Jr.
Source: CHEMICAL ENGINEERING COMMUNICATIONS 196 (5): 658-696 2009
Language: English
Document Type: Review
Author Keywords: Evaporation; Roughness; Wetting
Keywords Plus: BOILING HEAT-TRANSFER; SUPER-WATER-REPELLENT; BIOMIMETIC SUPERHYDROPHOBIC SURFACES; CONDENSING SESSILE DROPLET; VOLATILE LIQUID DROPLETS; ROUGH SURFACES; SOLID-SURFACES; THIN-FILM; HYDROPHOBIC SURFACES; WETTING PROPERTIES
Abstract: Liquid-vapor phase-change processes are becoming increasingly important in a wide variety of fields ranging from energy conversion, to microelectronics cooling, MEMs devices, and self-assembly. The phase change in these systems is governed by processes that occur at the contact line, where three phases meet. Evidence suggests that alterations of the surface chemistry and surface topography on the nanoscale can be used to dramatically enhance the phase-change process. This article reviews the current state of the art in nanoscale surface modification as applied to the enhancement of evaporative processes.
Reprint Address: Plawsky, J, Rensselaer Polytech Inst, Dept Chem & Biol Engn, Ricketts Bldg,110 8th St, Troy, NY 12180 USA.
Research Institution addresses: [Plawsky, Joel L.; Ojha, Manas; Chatterjee, Arya; Wayner, Peter C., Jr.] Rensselaer Polytech Inst, Dept Chem & Biol Engn, Troy, NY 12180 USA
E-mail Address: plawsky@rpi.edu
Cited References: ABDELSALAM ME, 2005, LANGMUIR, V21, P1753, DOI 10.1021/la047468q.
AJAEV VS, 2002, J COLLOID INTERF SCI, V254, P346, DOI 10.1006/jcis.2002.8631.
ANANTHAPADMANAB.KP, 1990, COLLOID SURFACE, V44, P281.
ANDERSON DM, 1995, PHYS FLUIDS, V7, P248.
ARAUJO YC, 1995, J COLLOID INTERF SCI, V176, P485.
BICO J, 2002, COLLOID SURFACE A, V206, P41.
BONACCURSO E, 2002, PHYS REV LETT, V88, P76103.
BOURGESMONNIER C, 1995, LANGMUIR, V11, P2820.
BRINKER CJ, 1999, ADV MATER, V11, P579.
BUFFONE C, 2005, PHYS REV E, V71, P56302.
BUTT HJ, 2008, LANGMUIR, V24, P4715, DOI 10.1021/la703640f.
CAO LL, 2007, LANGMUIR, V23, P4310, DOI 10.1021/la063572r.
CAO LL, 2008, LANGMUIR, V24, P1640, DOI 10.1021/la703401f.
CARBONE G, 2005, EUR PHYS J E, V16, P67, DOI 10.1140/epje/e2005-00008-y.
CARVALHO RDM, 1990, HEAT TRANSFER.
CASSIE ABD, 1944, T FARADAY SOC, V40, P546.
CHANG JY, 1997, INT J HEAT MASS TRAN, V40, P4437.
CHAO DF, 2001, J THERMOPHYS HEAT TR, V15, P416.
CHATTERJEE A, 2008, ASME C NAN MICR MIN.
CHAUDHURY MK, 1992, SCIENCE, V256, P1539.
CHEN CH, 2007, APPL PHYS LETT, V90, ARTN 173108.
CHEN Y, 2005, J COLLOID INTERF SCI, V281, P458, DOI 10.1016/j.jcis.2004.07.038.
CHENG YT, 2005, APPL PHYS LETT, V86, ARTN 144101.
CHENG YT, 2005, APPL PHYS LETT, V87, UNSP 194112-194113.
CHO JHJ, 2004, PHYS REV LETT, V92, ARTN 166102.
CHURAEV NV, 2001, LANGMUIR, V17, P1338.
COURBIN L, 2007, NAT MATER, V6, P661, DOI 10.1038/nmat1978.
DANIEL S, 2001, SCIENCE, V291, P633.
DASGUPTA S, 1995, AICHE J, V41, P2140.
DEEGAN RD, 1997, NATURE, V389, P827.
DHIR VK, 2001, AICHE J, V47, P813.
ERBIL HY, 1997, J PHYS CHEM B, V101, P6867.
ERBIL HY, 2003, SCIENCE, V299, P1377.
FAN JG, 2004, NANOTECHNOLOGY, V15, P501, DOI 10.1088/0957-4484/15/5/017.
FENG XJ, 2008, LANGMUIR, V24, P3918, DOI 10.1021/la703572z.
GAROFF S, 1989, J CHEM PHYS, V90, P7505.
GOKHALE SJ, 2004, PHYS FLUIDS, V16, P1942, DOI 10.1063/1.1718991.
GOKHALE SJ, 2005, LANGMUIR, V21, P8188, DOI 10.1021/la050603u.
GOOD RJ, 1952, J AM CHEM SOC, V74, P5041.
HALLINAN KP, 1994, J THERMOPHYS HEAT TR, V8, P709.
HE B, 2003, LANGMUIR, V19, P4999, DOI 10.1021/la0268348.
HELSETH LE, 2003, PHYS REV E, V68, P42601.
HONDA H, 2002, J HEAT TRANS-T ASME, V124, P383.
HONDA H, 2004, EXP THERM FLUID SCI, V28, P159, DOI 10.1016/S0894-1777(03)00035-9.
HORACEK B, 2005, INT J HEAT MASS TRAN, V48, P1425, DOI 10.1016/j.ijheatmasstransfer.2004.10.026.
HWANG UP, 1981, HEAT TRANSFER ELECTR, V20, P53.
JOPP J, 2004, LANGMUIR, V20, P10015, DOI 10.1021/la0497651.
KAKO T, 2004, J MATER SCI, V39, P547.
KAWAI A, 1994, JPN J APPL PHYS, V33, P1283.
KEBLINSKI P, 2005, MATER TODAY, V8, P36.
KERN J, 2003, J HEAT TRANS-T ASME, V125, P1106, DOI 10.1115/1.1622717.
KIM IY, 1996, J THERMOPHYS HEAT TR, V10, P320.
KNOCHE M, 1991, J AGR FOOD CHEM, V39, P202.
KU J, 1995, 1995 NAT HEAT TRANSF.
KU J, 2003, 012386 SAE.
KUBO H, 1999, J ENHANC HEAT TRANSF, V6, P151.
KUSUMAATMAJA H, 2008, EPL-EUROPHYS LETT, V81, ARTN 36003.
LAU KKS, 2003, NANO LETT, V3, P1701, DOI 10.1021/nl034704t.
LAZAR P, 2005, PHYS REV LETT, V95, ARTN 136103.
LEE SW, 2002, PHYS REV E 1, V65, ARTN 051602.
LEGER L, 1992, REP PROG PHYS, V55, P431.
LI XM, 2007, CHEM SOC REV, V36, P1350, DOI 10.1039/b602486f.
LIAO Q, 2007, INT J HEAT MASS TRAN, V50, P1231, DOI 10.1016/j.ijheatmasstransfer.2006.09.010.
MARMUR A, 2004, LANGMUIR, V20, P3517, DOI 10.1021/la036369u.
MARMUR A, 2006, SOFT MATTER, V2, P12, DOI 10.1039/b514811c.
MCHALE G, 2005, LANGMUIR, V21, P11053, DOI 10.1021/la0518797.
MEIRON TS, 2004, J COLLOID INTERF SCI, V274, P637, DOI 10.1016/j.jcis.2004.02.036.
MILLER JD, 1996, POLYM ENG SCI, V36, P1849.
MIWA M, 2000, LANGMUIR, V16, P5754.
MOULINET S, 2007, EUR PHYS J E, V24, P251, DOI 10.1140/epje/i2007-10235-y.
MUDAWART I, 1989, HEAT TRANSFER ELECT.
NAKAJIMA A, 1999, ADV MATER, V11, P1365.
NAKAYAMA W, 1984, 84WAHT89 ASME.
NARHE RD, 2004, PHYS REV LETT, V93, P76103.
NIKOLOV AD, 2002, ADV COLLOID INTERFAC, V96, P325.
NOSONOVSKY M, 2005, MICROSYST TECHNOL, V11, P535, DOI 10.1007/s00542-005-0602-9.
NOSONOVSKY M, 2007, ULTRAMICROSCOPY, V107, P969, DOI 10.1016/j.ultramic.2007.04.011.
OCONNOR JP, 1995, IEEE T COMPON PACK A, V18, P656.
OCONNOR JP, 1995, J HEAT TRANSFER, V117, P387.
OJHA M, 2006, 5 INT S CONT ANGL WE.
OKTAY S, 1974, J ELECTROCHEM SOC, V121, P912.
OKTAY S, 1988, HEAT TRANSFER ENG, V9, P93.
ONDA T, 1996, LANGMUIR, V12, P2125.
PALASANTZAS G, 1995, PHYS REV B, V51, P14612.
PALASANTZAS G, 2001, ACTA MATER, V49, P3533.
PANCHAMGAM S, 2006, THESIS RENSSELAER PO.
PANCHAMGAM SS, 2006, 9 AIAA ASME JOINT TH.
PANCHAMGAM SS, 2006, J HEAT TRANS-T ASME, V128, P1266, DOI 10.1115/1.2349506.
PARK K, 2003, INT J HEAT MASS TRAN, V46, P2381, DOI 10.1016/S0017-9310(02)00541-0.
PARKS CJ, 1987, AICHE J, V33, P1.
PETRIE RJ, 2004, LANGMUIR, V20, P9893, DOI 10.1021/la048612a.
PETTIGREW K, 2001, PROC IEEE MICR ELECT, P427.
PILOTEK S, 2003, J SOL-GEL SCI TECHN, V26, P789.
PLAWSKY JL, 2004, SUPERLATTICE MICROST, V35, P559, DOI 10.1016/j.spmi.2003.11.010.
POULARD C, 2003, LANGMUIR, V19, P8828, DOI 10.1021/la030162j.
PRATT DM, 2003, J HEAT TRANS-T ASME, V125, P867, DOI 10.1115/1.1599372.
QUERE D, 2002, PHYSICA A, V313, P32.
ROACH P, 2008, SOFT MATTER, V4, P224, DOI 10.1039/b712575p.
ROBBINS MO, 1991, PHYS REV A, V43, P4344.
SCHMATKO T, 2006, LANGMUIR, V22, P6843, DOI 10.1021/la060061w.
SCHONBERG JA, 1995, EXP THERM FLUID SCI, V10, P163.
SEFIANE K, 2006, APPL PHYS LETT, V89, UNSP 044106.
SHASTRY A, 2006, LANGMUIR, V22, P6161, DOI 10.1021/la0601657.
SHENG YJ, 2007, J CHEM PHYS, V127, ARTN 234704.
SHIBUICHI S, 1996, J PHYS CHEM-US, V100, P19512.
SOLTMAN D, 2008, LANGMUIR, V24, P2224, DOI 10.1021/la7026847.
SPIKES H, 2003, LANGMUIR, V19, P5065, DOI 10.1021/la034123j.
STEPHAN P, 1994, WARME STOFFUBERTRAG, V30, P119.
SUN TL, 2004, ANGEW CHEM INT EDIT, V43, P357, DOI 10.1002/anie.200352565.
SWEENEY JB, 1993, LANGMUIR, V9, P1551.
TADA H, 1995, LANGMUIR, V11, P136.
TAKATA Y, 2004, INT J HEAT FLUID FL, V25, P320, DOI 10.1016/j.ijheatfluidflow.2003.11.008.
TANASAWA I, 1976, J HEAT TRANSFER, V42, P2846.
THOMPSON PA, 1990, PHYS REV A, V41, P6830.
THOMPSON PA, 1997, NATURE, V389, P360.
TSAI CY, 2004, MATER LETT, V58, P1461, DOI 10.1016/j.matlet.2003.10.009.
TUNG SCY, 1982, THESIS RENSSELAER PO.
TUTEJA A, 2007, SCIENCE, V318, P1618, DOI 10.1126/science.1148326.
TYRRELL JWG, 2002, LANGMUIR, V18, P160.
ULMAN A, 1996, CHEM REV, V96, P1533.
WAGNER R, 1999, APPL ORGANOMET CHEM, V13, P201.
WASAN DT, 2003, NATURE, V423, P156, DOI 10.1038/nature01591.
WAYNER PC, 1980, J COLLOID INTERF SCI, V77, P495.
WAYNER PC, 1983, AM I AERONAUTICS AST.
WAYNER PC, 1985, MULTIPHASE FLOW HEAT.
WAYNER PC, 1999, AICHE J, V45, P2055.
WAYNER PC, 2002, COLLOID SURFACE A, V206, P157.
WEE SK, 2005, INT J HEAT MASS TRAN, V48, P265, DOI 10.1016/j.ijheatmasstransfer.2004.08.021.
WEE SK, 2006, J THERMOPHYS HEAT TR, V20, P320.
WENZEL RN, 1936, IND ENG CHEM, V28, P988.
WOLANSKY G, 1998, LANGMUIR, V14, P5292.
WOLANSKY G, 1999, COLLOID SURFACE A, V156, P381.
YOU SM, 1992, IEEE T COMPON HYBR, V15, P823.
ZHAI L, 2006, NANO LETT, V6, P1213, DOI 10.1021/nl060644q.
ZHANG XY, 2006, CHEMPHYSCHEM, V7, P2067, DOI 10.1002/cphc.200600229.
ZHENG L, 2004, J HEAT TRANSFER, V126, P169.
ZHENG QS, 2005, LANGMUIR, V21, P12207, DOI 10.1021/la052054y.
ZHENG YM, 2008, APPL PHYS LETT, V92, ARTN 084106.
ZHU S, 1994, COLLOID SURFACE A, V90, P63.
ZHU Y, 2001, PHYS REV LETT, V87, P96105.
ZHU YX, 2002, PHYS REV LETT, V88, ARTN 106102.
Cited Reference Count: 141
Times Cited: 0
Publisher: TAYLOR & FRANCIS INC; 325 CHESTNUT ST, SUITE 800, PHILADELPHIA, PA 19106 USA
Subject Category: Engineering, Chemical
ISSN: 0098-6445
DOI: 10.1080/00986440802569679
IDS Number: 383EE

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