Cited Article:    Holt JK. Fast mass transport through sub-2-nanometer carbon nanotubes
 Alert Expires:    09 NOV 2010
 Number of Citing Articles:    1 new records this week (1 in this e-mail)
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AU Thomas, JA
   Iutzi, RM
   McGaughey, AJH
AF Thomas, John A.
   Iutzi, Ryan M.
   McGaughey, Alan J. H.
TI Thermal conductivity and phonon transport in empty and water-filled
   carbon nanotubes
SO PHYSICAL REVIEW B
LA English
DT Article
ID MOLECULAR-DYNAMICS; HEAT-CONDUCTION; GRAPHITE; FLOW; SEMICONDUCTORS;
   SIMULATIONS; COMPOSITES; GRAPHENE; LIQUID
AB The thermal conductivities of empty and water-filled single-walled
   carbon nanotubes (CNTs) with diameters between 0.83 and 1.36 nm and
   lengths ranging from 200 to 1400 nm are predicted using molecular
   dynamics simulation. Using a direct application of the Fourier law, we
   explore the transition to fully diffusive phonon transport with
   increasing CNT length. For empty CNTs, we find that the CNT length
   required to obtain fully diffusive phonon transport decreases from 1090
   nm for the 0.83-nm-diameter CNT to 510 nm for the 1.36-nm-diameter CNT.
   The magnitude of the fully diffusive thermal conductivity also
   decreases monotonically with increasing CNT diameter. We find that the
   fully diffusive thermal conductivity of water-filled CNTs is 20%-35%
   lower than that of empty CNTs. By examining the empty and water-filled
   CNT density of states, we attribute the thermal conductivity reductions
   to an increase in low-frequency acoustic phonon scattering due to
   interactions with the water molecules.
C1 [Thomas, John A.; Iutzi, Ryan M.; McGaughey, Alan J. H.] Carnegie Mellon Univ, Dept Mech Engn, Pittsburgh, PA 15213 USA.
RP Thomas, JA, Carnegie Mellon Univ, Dept Mech Engn, Pittsburgh, PA 15213
   USA.
EM mcgaughey@cmu.edu
CR ABASCAL JLF, 2005, J CHEM PHYS, V123, P34505, ARTN 234505
   ALLEN MP, 1987, COMPUTER SIMULATION
   ASHCROFT NW, 1976, SOLID STATE PHYS
   BALANDIN AA, 2008, NANO LETT, V8, P902, DOI 10.1021/nl0731872
   BENEDICT LX, 1996, SOLID STATE COMMUN, V100, P177
   BRENNER DW, 2002, J PHYS-CONDENS MAT, V14, P783
   CARLBORG CF, 2008, PHYS REV B, V78, ARTN 205406
   CHEN YF, 2005, PHYS REV B, V72, ARTN 174302
   DEBERNARDI A, 1995, PHYS REV LETT, V75, P1819
   DONADIO D, 2007, PHYS REV LETT, V99, ARTN 255502
   DOVE MT, 1993, INTRO LATTICE DYNAMI
   EVANS W, 2007, J CHEM PHYS, V126, P54504, ARTN 154504
   HARRIS PJF, 2009, CARBON NANOTUBE SCI
   HEINO P, 2009, MICROSYST TECHNOL, V15, P75, DOI
   10.1007/s00542-008-0641-0
   HOLT JK, 2006, SCIENCE, V312, P1034, DOI 10.1126/science.1126298
   HONE J, 1999, PHYS REV B, V59, P2514
   HONE J, 2000, APPL PHYS LETT, V77, P666
   HONE J, 2004, DEKKER ENCY NANOSCIE, P603
   HU JN, 2009, NANO LETT, V9, P2730, DOI 10.1021/nl901231s
   HUXTABLE ST, 2003, NAT MATER, V2, P731, DOI 10.1038/nmat996
   IKESHOJI T, 1994, MOL PHYS, V81, P251
   JENNESS GR, 2009, J PHYS CHEM C, V113, P10242, DOI 10.1021/jp9015307
   KARNEY CFF, 2007, J MOL GRAPH MODEL, V25, P595, DOI
   10.1016/j.jmgm.2006.04.002
   KOFINGER J, 2008, P NATL ACAD SCI USA, V105, P13218, DOI
   10.1073/pnas.0801448105
   LANDRY ES, 2008, PHYS REV B, V77, ARTN 184302
   LINDSAY L, 2009, PHYS REV B, V80, ARTN 125407
   LUKES JR, 2007, ASME, V129, P705
   MARADUDIN AA, 1962, PHYS REV, V128, P2589
   MARUYAMA S, 2003, NANOSC MICROSC THERM, V7, P41
   MINGO N, 2005, NANO LETT, V5, P1221, DOI 10.1021/nl050714d
   MINGO N, 2005, PHYS REV LETT, V95, ARTN 096105
   MORELAND JF, 2004, MICROSCALE THERM ENG, V8, P61, DOI
   10.1080/10893950490272939
   PADGETT CW, 2004, NANO LETT, V4, P1051, DOI 10.1021/nl049645d
   POP E, 2006, NANO LETT, V6, P96, DOI 10.1021/nl052145f
   SAITO R, 2003, PHYS PROPERTIES CARB
   SCHELLING PK, 2002, PHYS REV B, V65, ARTN 144306
   SELLAN DP, UNPUB
   SHENOGIN S, 2004, APPL PHYS LETT, V85, P2229, DOI 10.1063/1.1794370
   SHENOGIN S, 2004, J APPL PHYS, V95, P8136, DOI 10.1063/1.1736328
   SHIOMI J, 2006, PHYS REV B, V73, ARTN 205420
   SHIOMI J, 2008, JPN J APPL PHYS 1, V47, P2005, DOI 10.1143/JJAP.47.2005
   SHIOMI J, 2009, NANOTECHNOLOGY, V20, P55708, ARTN 055708
   SOPER AK, 1994, J CHEM PHYS, V101, P6888
   SRIVASTAVA GP, 1980, J PHYS CHEM SOLIDS, V41, P357
   SRIVASTAVA GP, 2006, HIGH THERMAL CONDUCT, P1
   TERSOFF J, 1989, PHYS REV B, V39, P5566
   THOMAS JA, 2008, J CHEM PHYS, V128, P84715, ARTN 084715
   THOMAS JA, 2008, NANO LETT, V8, P2788, DOI 10.1021/nl8013617
   THOMAS JA, 2009, P SHTC ASME NEW YORK
   THOMAS JA, 2009, PHYS REV LETT, V102, ARTN 184502
   TURNEY JE, THESIS CARNEIGE MELL
   WERDER T, 2003, J PHYS CHEM B, V107, P1345, DOI 10.1021/jp0268112
   WHITBY M, 2008, NANO LETT, V8, P2632, DOI 10.1021/nl080705f
   YANG J, 2004, THERMAL CONDUCTIVITY, P1
   YU CH, 2005, NANO LETT, V5, P1842, DOI 10.1021/nl051044e
   ZHAO XC, 2005, MOL SIMULAT, V31, P1, DOI 10.1080/0892702042000272889
   ZIMAN JM, 1960, ELECT PHONONS THEORY
NR 57
TC 0
PU AMER PHYSICAL SOC; ONE PHYSICS ELLIPSE, COLLEGE PK, MD 20740-3844 USA
SN 1098-0121
DI 10.1103/PhysRevB.81.045413
PD JAN
VL 81
IS 4
AR 045413
SC Physics, Condensed Matter
GA 548XG
UT ISI:000274002500095
ER
EF
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